Most Photocap encapsulant formulations can be manufactured via STR's proprietary "User-Friendly" (UF) process. The UF process is a method of manufacturing dimensionally stable encapsulant sheet that has zero shrinkage during the lamination process.

Because UF-manufactured encapsulant products do not shrink during lamination, void formation induced by shrinkage is eliminated and more aggressive temperature ramping during lamination can be tolerated, permitting higher throughput.

Please feel free do download and review our UF Frequently Asked Questions (FAQ) document

STR	Competitor
Pictured above: Samples of EVA after 3 minutes on a hot plate (to simulate the module lamination process). Both were cut to match the glass underneath, but the Competitor sample has distorted considerably (high shrinkage, poor dimensional stability).

Pictured below: A defect resulting from high EVA shrinkage, causing the rejection of the entire solar module